My Quote Request
5962-00-323-1214
20 Products
C4370Q
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003231214
NSN
5962-00-323-1214
MFG
PHILIPS SEMICONDUCTORS INC
Description
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 226207-000
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
226207-001
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003231218
NSN
5962-00-323-1218
MFG
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION I
Description
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 226207-001
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
226208-000
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003231218
NSN
5962-00-323-1218
MFG
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION I
Description
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 226207-001
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
C4370W
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003231218
NSN
5962-00-323-1218
MFG
LANSDALE SEMICONDUCTOR INC .
Description
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 226207-001
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
C4371Q
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003231218
NSN
5962-00-323-1218
MFG
PHILIPS SEMICONDUCTORS INC
Description
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 226207-001
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
226220-000
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003231230
NSN
5962-00-323-1230
MFG
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION I
Description
FEATURES PROVIDED: MONOLITHIC
INCLOSURE MATERIAL: SILICON
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 226220-000
SPEC/STD CONTROLLING DATA:
Related Searches:
C4376W
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003231230
NSN
5962-00-323-1230
MFG
PHILIPS SEMICONDUCTORS INC
Description
FEATURES PROVIDED: MONOLITHIC
INCLOSURE MATERIAL: SILICON
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 226220-000
SPEC/STD CONTROLLING DATA:
Related Searches:
226232-000
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003231236
NSN
5962-00-323-1236
MFG
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION I
Description
FEATURES PROVIDED: MONOLITHIC AND HYBRID
INCLOSURE MATERIAL: SILICON
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 226232-000
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
CDA6-01
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003231236
NSN
5962-00-323-1236
MFG
CRYSTALONICS INC.
Description
FEATURES PROVIDED: MONOLITHIC AND HYBRID
INCLOSURE MATERIAL: SILICON
MANUFACTURERS CODE: 81413
MFR SOURCE CONTROLLING REFERENCE: 226232-000
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
SPEC/STD CONTROLLING DATA:
Related Searches:
405AS150
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962003239993
NSN
5962-00-323-9993
MFG
NAVAL AIR SYSTEMS COMMAND
Description
BODY HEIGHT: 0.750 INCHES NOMINAL
BODY LENGTH: 1.550 INCHES NOMINAL
BODY WIDTH: 0.780 INCHES NOMINAL
DESIGN FUNCTION AND QUANTITY: 1 ARITHMETIC LOGIC UNIT
FEATURES PROVIDED: MONOLITHIC AND NEGATIVE OUTPUTS AND BIPOLAR AND UNIPOLAR
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: PLASTIC
INPUT CIRCUIT PATTERN: 1 INPUT
OPERATING TEMP RANGE: 5.0 TO 55.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 9 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 15.0 VOLTS MAXIMUM POWER SOURCE
Related Searches:
LGP4
MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962003239993
NSN
5962-00-323-9993
MFG
TELEDYNE INC TELEDYNE COMPONENTS DIV
Description
BODY HEIGHT: 0.750 INCHES NOMINAL
BODY LENGTH: 1.550 INCHES NOMINAL
BODY WIDTH: 0.780 INCHES NOMINAL
DESIGN FUNCTION AND QUANTITY: 1 ARITHMETIC LOGIC UNIT
FEATURES PROVIDED: MONOLITHIC AND NEGATIVE OUTPUTS AND BIPOLAR AND UNIPOLAR
III PRECIOUS MATERIAL: GOLD
III PRECIOUS MATERIAL AND LOCATION: TERMINALS GOLD
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: PLASTIC
INPUT CIRCUIT PATTERN: 1 INPUT
OPERATING TEMP RANGE: 5.0 TO 55.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: GOLD
TERMINAL TYPE AND QUANTITY: 9 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 15.0 VOLTS MAXIMUM POWER SOURCE
Related Searches:
932473-501B
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003240368
NSN
5962-00-324-0368
MFG
RAYTHEON COMPANY
Description
BODY HEIGHT: 0.075 INCHES MAXIMUM
BODY LENGTH: 0.270 INCHES MAXIMUM
BODY WIDTH: 0.155 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 2 GATE, AND-NAND AND 2 GATE, OR-NOR
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: DUAL 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 120.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 100.0 DEG CELSIUS
OUTPUT LOGIC FORM: EMITTER-COUPLED LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
Related Searches:
MC1660SH2
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003240368
NSN
5962-00-324-0368
MFG
FREESCALE SEMICONDUCTOR INC.
Description
BODY HEIGHT: 0.075 INCHES MAXIMUM
BODY LENGTH: 0.270 INCHES MAXIMUM
BODY WIDTH: 0.155 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 2 GATE, AND-NAND AND 2 GATE, OR-NOR
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: DUAL 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 120.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 100.0 DEG CELSIUS
OUTPUT LOGIC FORM: EMITTER-COUPLED LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
Related Searches:
MC1660SP2
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003240368
NSN
5962-00-324-0368
MFG
FREESCALE SEMICONDUCTOR INC.
Description
BODY HEIGHT: 0.075 INCHES MAXIMUM
BODY LENGTH: 0.270 INCHES MAXIMUM
BODY WIDTH: 0.155 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 2 GATE, AND-NAND AND 2 GATE, OR-NOR
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: DUAL 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 120.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 100.0 DEG CELSIUS
OUTPUT LOGIC FORM: EMITTER-COUPLED LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
Related Searches:
SC8380-3
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003240368
NSN
5962-00-324-0368
MFG
FREESCALE SEMICONDUCTOR INC.
Description
BODY HEIGHT: 0.075 INCHES MAXIMUM
BODY LENGTH: 0.270 INCHES MAXIMUM
BODY WIDTH: 0.155 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 2 GATE, AND-NAND AND 2 GATE, OR-NOR
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: DUAL 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 120.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 100.0 DEG CELSIUS
OUTPUT LOGIC FORM: EMITTER-COUPLED LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
Related Searches:
TS-3504
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962003240368
NSN
5962-00-324-0368
MFG
MICROSEMI CORP.- MASSACHUSETTS DBA MICROSEMI LAWRENCE
Description
BODY HEIGHT: 0.075 INCHES MAXIMUM
BODY LENGTH: 0.270 INCHES MAXIMUM
BODY WIDTH: 0.155 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 2 GATE, AND-NAND AND 2 GATE, OR-NOR
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE OUTPUTS
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: DUAL 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 120.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 100.0 DEG CELSIUS
OUTPUT LOGIC FORM: EMITTER-COUPLED LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
Related Searches:
932085-557B
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962003240527
NSN
5962-00-324-0527
MFG
RAYTHEON COMPANY
Description
(NON-CORE DATA) BIT QUANTITY: 512
(NON-CORE DATA) WORD QUANTITY: 64
BODY HEIGHT: 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM
BODY LENGTH: 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND EXPANDABLE AND W/BUFFERED OUTPUT AND WIRE-OR OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND W/DECODED OUTPUT
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 8 INPUT
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 FLAT LEADS
TEST DATA DOCUMENT: 82577-932085 DRAWING
TIME RATING PER CHACTERISTIC: 25.00 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
Related Searches:
HPR0M9-0512G0782
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962003240527
NSN
5962-00-324-0527
MFG
INTERSIL CORPORATION
Description
(NON-CORE DATA) BIT QUANTITY: 512
(NON-CORE DATA) WORD QUANTITY: 64
BODY HEIGHT: 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM
BODY LENGTH: 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND EXPANDABLE AND W/BUFFERED OUTPUT AND WIRE-OR OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND W/DECODED OUTPUT
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 8 INPUT
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 FLAT LEADS
TEST DATA DOCUMENT: 82577-932085 DRAWING
TIME RATING PER CHACTERISTIC: 25.00 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
Related Searches:
ROM/PROM FAMILY 001
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962003240527
NSN
5962-00-324-0527
ROM/PROM FAMILY 001
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962003240527
NSN
5962-00-324-0527
MFG
DLA LAND AND MARITIME
Description
(NON-CORE DATA) BIT QUANTITY: 512
(NON-CORE DATA) WORD QUANTITY: 64
BODY HEIGHT: 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM
BODY LENGTH: 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND EXPANDABLE AND W/BUFFERED OUTPUT AND WIRE-OR OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND W/DECODED OUTPUT
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 8 INPUT
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 FLAT LEADS
TEST DATA DOCUMENT: 82577-932085 DRAWING
TIME RATING PER CHACTERISTIC: 25.00 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
Related Searches:
SCM780FH17
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962003240527
NSN
5962-00-324-0527
MFG
FREESCALE SEMICONDUCTOR INC.
Description
(NON-CORE DATA) BIT QUANTITY: 512
(NON-CORE DATA) WORD QUANTITY: 64
BODY HEIGHT: 0.050 INCHES MINIMUM AND 0.085 INCHES MAXIMUM
BODY LENGTH: 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND EXPANDABLE AND W/BUFFERED OUTPUT AND WIRE-OR OUTPUTS AND BIPOLAR AND PROGRAMMABLE AND PROGRAMMED AND W/DECODED OUTPUT
INCLOSURE CONFIGURATION: FLAT PACK
INCLOSURE MATERIAL: CERAMIC AND GLASS
INPUT CIRCUIT PATTERN: 8 INPUT
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 FLAT LEADS
TEST DATA DOCUMENT: 82577-932085 DRAWING
TIME RATING PER CHACTERISTIC: 25.00 NANOSECONDS MINIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 75.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE