My Quote Request
5962-01-128-6548
20 Products
ROM/PROM FAMILY 007
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962011286548
NSN
5962-01-128-6548
ROM/PROM FAMILY 007
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962011286548
NSN
5962-01-128-6548
MFG
DLA LAND AND MARITIME
Description
(NON-CORE DATA) BIT QUANTITY: 8192
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.930 INCHES MAXIMUM
BODY WIDTH: 0.295 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 12 INPUT
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
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MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962011285965
NSN
5962-01-128-5965
MFG
INTERSIL CORPORATION
Description
MICROCIRCUIT,DIGITAL
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2375031-501
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962011285966
NSN
5962-01-128-5966
MFG
LOCKHEED MARTIN CORP LOCKHEED MARTIN INFORMATION SYSTEMS AUTOMATED SPARES
Description
BODY HEIGHT: 0.350 INCHES NOMINAL
BODY LENGTH: 1.400 INCHES NOMINAL
BODY WIDTH: 0.100 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 BUFFER
FEATURES PROVIDED: HYBRID AND MONOLITHIC
INCLOSURE CONFIGURATION: SINGLE-IN-LINE
INCLOSURE MATERIAL: RESIN
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 0.8 WATTS
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 10 PIN
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 20.0 VOLTS MAXIMUM POWER SOURCE
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SM-C-868532-1
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962011285966
NSN
5962-01-128-5966
MFG
US ARMY COMMUNICATIONS & ELECTRONICS MATERIEL READINESS COMMAND LOGISTICS ENGINEERING DIR
Description
BODY HEIGHT: 0.350 INCHES NOMINAL
BODY LENGTH: 1.400 INCHES NOMINAL
BODY WIDTH: 0.100 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 BUFFER
FEATURES PROVIDED: HYBRID AND MONOLITHIC
INCLOSURE CONFIGURATION: SINGLE-IN-LINE
INCLOSURE MATERIAL: RESIN
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 0.8 WATTS
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 10 PIN
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 20.0 VOLTS MAXIMUM POWER SOURCE
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TS-3812-1
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962011285966
NSN
5962-01-128-5966
MFG
MICROSEMI CORP.- MASSACHUSETTS DBA MICROSEMI LAWRENCE
Description
BODY HEIGHT: 0.350 INCHES NOMINAL
BODY LENGTH: 1.400 INCHES NOMINAL
BODY WIDTH: 0.100 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 BUFFER
FEATURES PROVIDED: HYBRID AND MONOLITHIC
INCLOSURE CONFIGURATION: SINGLE-IN-LINE
INCLOSURE MATERIAL: RESIN
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 0.8 WATTS
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 10 PIN
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 20.0 VOLTS MAXIMUM POWER SOURCE
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567230-36
MICROCIRCUIT ASSEMBLY
NSN, MFG P/N
5962011285967
NSN
5962-01-128-5967
MFG
RAYTHEON SERVICE CO LOGISTICS SUPPORT CENTER
Description
MICROCIRCUIT ASSEMBLY
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567230-34
MICROCIRCUIT ASSEMBLY
NSN, MFG P/N
5962011285968
NSN
5962-01-128-5968
MFG
RAYTHEON SERVICE CO LOGISTICS SUPPORT CENTER
Description
MICROCIRCUIT ASSEMBLY
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567230-33
MICROCIRCUIT ASSEMBLY
NSN, MFG P/N
5962011285969
NSN
5962-01-128-5969
MFG
RAYTHEON SERVICE CO LOGISTICS SUPPORT CENTER
Description
MICROCIRCUIT ASSEMBLY
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MICROCIRCUIT ASSEMBLY
NSN, MFG P/N
5962011285970
NSN
5962-01-128-5970
MFG
RAYTHEON SERVICE CO LOGISTICS SUPPORT CENTER
Description
MICROCIRCUIT ASSEMBLY
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MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962011286377
NSN
5962-01-128-6377
MFG
FAIRCHILD SEMICONDUCTOR CORP
Description
BODY LENGTH: 0.185 INCHES MAXIMUM
BODY OUTSIDE DIAMETER: 0.335 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: TO-99 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
DESIGN FUNCTION AND QUANTITY: 1 AMPLIFIER, OPERATIONAL, ANALOG
FEATURES PROVIDED: MONOLITHIC
III OVERALL DIAMETER: 0.370 INCHES MAXIMUM
III OVERALL LENGTH: 0.790 INCHES MAXIMUM
INCLOSURE CONFIGURATION: CAN
INCLOSURE MATERIAL: METAL
INPUT CIRCUIT PATTERN: 2 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 175.0 DEG CELSIUS
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725016A0165-002
MICROCIRCUIT
NSN, MFG P/N
5962011286382
NSN
5962-01-128-6382
MFG
QUARTERMASTER GENERAL
Description
MICROCIRCUIT
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MICROCIRCUIT,LINEAR
NSN, MFG P/N
5962011286393
NSN
5962-01-128-6393
MFG
ADVANCED MICRO DEVICES INC DBA A M D
Description
BODY HEIGHT: 0.185 INCHES MAXIMUM
BODY LENGTH: 0.785 INCHES MAXIMUM
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.285 INCHES MAXIMUM
CAPITANCE RATING PER CHARACTERISTIC: 2.00 INPUT PICOFARADS NOMINAL
CURRENT RATING PER CHARACTERISTIC: 24.00 MILLIAMPERES MAXIMUM SUPPLY
DESIGN FUNCTION AND QUANTITY: 1 AMPLIFIER, VIDEO, DIFFERENTIAL
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 2 INPUT
MAXIMUM POWER DISSIPATION RATING: 500.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 14 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC: 10.00 NANOSECONDS MAXIMUM DELAY
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -8.0 VOLTS MINIMUM POWER SOURCE AND 8.0 VOLTS MAXIMUM POWER SOURCE
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39919-4
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962011286547
NSN
5962-01-128-6547
MFG
ROCKWELL COLLINS AEROSPACE & ELECTRONICS INC. DBA RC DISPLAYS SYSTEMS
Description
MICROCIRCUIT,DIGITAL
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MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962011286547
NSN
5962-01-128-6547
MFG
ROCKWELL COLLINS AEROSPACE & ELECTRONICS INC. DBA RC DISPLAYS SYSTEMS
Description
MICROCIRCUIT,DIGITAL
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ROM/PROM FAMILY 010
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962011286547
NSN
5962-01-128-6547
ROM/PROM FAMILY 010
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962011286547
NSN
5962-01-128-6547
MFG
DLA LAND AND MARITIME
Description
MICROCIRCUIT,DIGITAL
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39937-24
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962011286548
NSN
5962-01-128-6548
MFG
ROCKWELL COLLINS AEROSPACE & ELECTRONICS INC. DBA RC DISPLAYS SYSTEMS
Description
(NON-CORE DATA) BIT QUANTITY: 8192
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.930 INCHES MAXIMUM
BODY WIDTH: 0.295 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 12 INPUT
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
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53S841
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962011286548
NSN
5962-01-128-6548
MFG
MMI/AMD
Description
(NON-CORE DATA) BIT QUANTITY: 8192
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.930 INCHES MAXIMUM
BODY WIDTH: 0.295 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 12 INPUT
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
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MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962011286548
NSN
5962-01-128-6548
MFG
PHILIPS SEMICONDUCTORS INC
Description
(NON-CORE DATA) BIT QUANTITY: 8192
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.930 INCHES MAXIMUM
BODY WIDTH: 0.295 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 12 INPUT
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
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MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962011286548
NSN
5962-01-128-6548
MFG
INTERSIL CORPORATION
Description
(NON-CORE DATA) BIT QUANTITY: 8192
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.930 INCHES MAXIMUM
BODY WIDTH: 0.295 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 12 INPUT
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
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MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962011286548
NSN
5962-01-128-6548
MFG
ROCKWELL COLLINS AEROSPACE & ELECTRONICS INC. DBA RC DISPLAYS SYSTEMS
Description
(NON-CORE DATA) BIT QUANTITY: 8192
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.200 INCHES MAXIMUM
BODY LENGTH: 0.930 INCHES MAXIMUM
BODY WIDTH: 0.295 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 12 INPUT
MEMORY DEVICE TYPE: ROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 125.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE