My Quote Request
5962-01-258-5303
20 Products
51-5177D02
MODULE
NSN, MFG P/N
5962012585303
NSN
5962-01-258-5303
MFG
MOTOROLA COMMUNICATIONS GROUP PARTS DEPT DIV OF MOTOROLA INC
Description
MODULE
Related Searches:
ROM/PROM
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012585224
NSN
5962-01-258-5224
MFG
DLA LAND AND MARITIME
Description
(NON-CORE DATA) BIT QUANTITY: 32768
(NON-CORE DATA) WORD QUANTITY: 4096
BODY HEIGHT: 0.210 INCHES MAXIMUM
BODY LENGTH: 1.290 INCHES MAXIMUM
BODY WIDTH: 0.610 INCHES MAXIMUM
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND W/ENABLE
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 14 INPUT
MEMORY DEVICE TYPE: PROM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
Related Searches:
6086505-2
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012585225
NSN
5962-01-258-5225
MFG
LOCKHEED MARTIN CORPORATION DBA MISSION SYSTEMS & SENSORS
Description
FEATURES PROVIDED: PROGRAMMABLE
INCLOSURE CONFIGURATION: FLAT PACK
MEMORY DEVICE TYPE: PAL
TERMINAL TYPE AND QUANTITY: 28 FLAT LEADS
Related Searches:
6135334-13
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012585225
NSN
5962-01-258-5225
MFG
LOCKHEED MARTIN CORPORATION DBA MISSION SYSTEMS & SENSORS
Description
FEATURES PROVIDED: PROGRAMMABLE
INCLOSURE CONFIGURATION: FLAT PACK
MEMORY DEVICE TYPE: PAL
TERMINAL TYPE AND QUANTITY: 28 FLAT LEADS
Related Searches:
6959633-08-010
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012585225
NSN
5962-01-258-5225
MFG
LOCKHEED MARTIN CORPORATION DBA MISSION SYSTEMS & SENSORS
Description
FEATURES PROVIDED: PROGRAMMABLE
INCLOSURE CONFIGURATION: FLAT PACK
MEMORY DEVICE TYPE: PAL
TERMINAL TYPE AND QUANTITY: 28 FLAT LEADS
Related Searches:
ROM/PROM
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012585225
NSN
5962-01-258-5225
MFG
DLA LAND AND MARITIME
Description
FEATURES PROVIDED: PROGRAMMABLE
INCLOSURE CONFIGURATION: FLAT PACK
MEMORY DEVICE TYPE: PAL
TERMINAL TYPE AND QUANTITY: 28 FLAT LEADS
Related Searches:
6086505-2
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012585226
NSN
5962-01-258-5226
MFG
LOCKHEED MARTIN CORPORATION DBA MISSION SYSTEMS & SENSORS
Description
FEATURES PROVIDED: PROGRAMMABLE
INCLOSURE CONFIGURATION: FLAT PACK
MEMORY DEVICE TYPE: PAL
TERMINAL TYPE AND QUANTITY: 28 FLAT LEADS
Related Searches:
6135334-12
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012585226
NSN
5962-01-258-5226
MFG
LOCKHEED MARTIN CORPORATION DBA MISSION SYSTEMS & SENSORS
Description
FEATURES PROVIDED: PROGRAMMABLE
INCLOSURE CONFIGURATION: FLAT PACK
MEMORY DEVICE TYPE: PAL
TERMINAL TYPE AND QUANTITY: 28 FLAT LEADS
Related Searches:
6959632-08-010
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012585226
NSN
5962-01-258-5226
MFG
LOCKHEED MARTIN CORPORATION DBA MISSION SYSTEMS & SENSORS
Description
FEATURES PROVIDED: PROGRAMMABLE
INCLOSURE CONFIGURATION: FLAT PACK
MEMORY DEVICE TYPE: PAL
TERMINAL TYPE AND QUANTITY: 28 FLAT LEADS
Related Searches:
ROM/PROM
MICROCIRCUIT,MEMORY
NSN, MFG P/N
5962012585226
NSN
5962-01-258-5226
MFG
DLA LAND AND MARITIME
Description
FEATURES PROVIDED: PROGRAMMABLE
INCLOSURE CONFIGURATION: FLAT PACK
MEMORY DEVICE TYPE: PAL
TERMINAL TYPE AND QUANTITY: 28 FLAT LEADS
Related Searches:
1820-2716
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012585228
NSN
5962-01-258-5228
MFG
AGILENT TECHNOLOGIES INC. DBA NORTH AMERICAN CONTACT CENTER DIV AGILENT BUSINESS CENTER
Description
BODY HEIGHT: 0.180 INCHES MAXIMUM
BODY LENGTH: 0.915 INCHES MAXIMUM
BODY WIDTH: 0.285 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 DRIVER, DECODER
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 8 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 18.0 VOLTS MAXIMUM POWER SOURCE
Related Searches:
MC14513BALDS
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012585228
NSN
5962-01-258-5228
MFG
FREESCALE SEMICONDUCTOR INC.
Description
BODY HEIGHT: 0.180 INCHES MAXIMUM
BODY LENGTH: 0.915 INCHES MAXIMUM
BODY WIDTH: 0.285 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 DRIVER, DECODER
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 8 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 18.0 VOLTS MAXIMUM POWER SOURCE
Related Searches:
MC14513BCL
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012585228
NSN
5962-01-258-5228
MFG
FREESCALE SEMICONDUCTOR INC.
Description
BODY HEIGHT: 0.180 INCHES MAXIMUM
BODY LENGTH: 0.915 INCHES MAXIMUM
BODY WIDTH: 0.285 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 DRIVER, DECODER
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 8 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 18.0 VOLTS MAXIMUM POWER SOURCE
Related Searches:
55898-90205
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012585230
NSN
5962-01-258-5230
MFG
AAI CORPORATION
Description
BODY HEIGHT: 0.180 INCHES MAXIMUM
BODY LENGTH: 0.400 INCHES MAXIMUM
BODY WIDTH: 0.291 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 2 DRIVER, PERIPHERAL
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND HIGH IMPEDANCE AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1133.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 8 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 16.0 VOLTS MAXIMUM POWER SOURCE
Related Searches:
DS1632J-8/883
MICROCIRCUIT,DIGITAL
NSN, MFG P/N
5962012585230
NSN
5962-01-258-5230
MFG
NATIONAL SEMICONDUCTOR CORPORATION
Description
BODY HEIGHT: 0.180 INCHES MAXIMUM
BODY LENGTH: 0.400 INCHES MAXIMUM
BODY WIDTH: 0.291 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 2 DRIVER, PERIPHERAL
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND HIGH IMPEDANCE AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 4 INPUT
MAXIMUM POWER DISSIPATION RATING: 1133.0 MILLIWATTS
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 8 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 16.0 VOLTS MAXIMUM POWER SOURCE
Related Searches:
51-84333G07
MODULE
NSN, MFG P/N
5962012585299
NSN
5962-01-258-5299
MFG
MOTOROLA COMMUNICATIONS GROUP PARTS DEPT DIV OF MOTOROLA INC
Description
MODULE
Related Searches:
51-84333G08
MODULE
NSN, MFG P/N
5962012585300
NSN
5962-01-258-5300
MFG
MOTOROLA COMMUNICATIONS GROUP PARTS DEPT DIV OF MOTOROLA INC
Description
MODULE
Related Searches:
5PK-814
MODULE
NSN, MFG P/N
5962012585301
NSN
5962-01-258-5301
MFG
MOTOROLA COMMUNICATIONS GROUP PARTS DEPT DIV OF MOTOROLA INC
Description
MODULE
Related Searches:
PK-814
MODULE
NSN, MFG P/N
5962012585301
NSN
5962-01-258-5301
MFG
MOTOROLA COMMUNICATIONS GROUP PARTS DEPT DIV OF MOTOROLA INC
Description
MODULE
Related Searches:
51-5177D04
MODULE
NSN, MFG P/N
5962012585302
NSN
5962-01-258-5302
MFG
MOTOROLA COMMUNICATIONS GROUP PARTS DEPT DIV OF MOTOROLA INC
Description
MODULE