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5962-01-303-3550

20 Products

DS1232

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033550

NSN

5962-01-303-3550

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DS1232

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033550

NSN

5962-01-303-3550

MFG

DALLAS SEMICONDUCTOR CORPORATION DBA MAXIM DALLAS DIRECT

Description

BODY HEIGHT: 0.120 INCHES MINIMUM AND 0.140 INCHES MAXIMUM
BODY LENGTH: 0.360 INCHES MINIMUM AND 0.400 INCHES MAXIMUM
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM
DESIGN FUNCTION AND QUANTITY: 1 MONITOR
FEATURES PROVIDED: W/RESET AND W/STROBE AND POSITIVE OUTPUTS AND MONOLITHIC
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 5 INPUT
OPERATING TEMP RANGE: 0.0 TO 70.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -40.0 TO 85.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 8 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

CDP1823CD

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033037

NSN

5962-01-303-3037

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CDP1823CD

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033037

NSN

5962-01-303-3037

MFG

U S DEPT OF TRANSPORTATION FEDERAL AVIATION ADMINISTRATION

Description

(NON-CORE DATA) BIT QUANTITY: 1024
(NON-CORE DATA) WORD QUANTITY: 128
FEATURES PROVIDED: BURN IN AND HIGH SPEED AND STATIC OPERATION
III END ITEM IDENTIFICATION: FLIGHT SERVICE AUTOMATED SYSTEM (FSAS)
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 13 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS

A3012569-5

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033095

NSN

5962-01-303-3095

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A3012569-5

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033095

NSN

5962-01-303-3095

MFG

US ARMY COMMUNICATIONS & ELECTRONICS MATERIEL READINESS COMMAND LOGISTICS ENGINEERING DIR

CDP1823CJ/3

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033095

NSN

5962-01-303-3095

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CDP1823CJ/3

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033095

NSN

5962-01-303-3095

MFG

INTERSIL CORPORATION

R-22-8566

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033097

NSN

5962-01-303-3097

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R-22-8566

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033097

NSN

5962-01-303-3097

MFG

EADS NORTH AMERICA INC. DBA EADS NORTH AMERICA TEST AND SERVICES DIV EADS NORTH AMERICA TEST AND SERVICES

R-22-8565

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033098

NSN

5962-01-303-3098

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R-22-8565

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033098

NSN

5962-01-303-3098

MFG

EADS NORTH AMERICA INC. DBA EADS NORTH AMERICA TEST AND SERVICES DIV EADS NORTH AMERICA TEST AND SERVICES

R-22-8564

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033099

NSN

5962-01-303-3099

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R-22-8564

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033099

NSN

5962-01-303-3099

MFG

EADS NORTH AMERICA INC. DBA EADS NORTH AMERICA TEST AND SERVICES DIV EADS NORTH AMERICA TEST AND SERVICES

R-22-8563

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033100

NSN

5962-01-303-3100

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R-22-8563

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033100

NSN

5962-01-303-3100

MFG

EADS NORTH AMERICA INC. DBA EADS NORTH AMERICA TEST AND SERVICES DIV EADS NORTH AMERICA TEST AND SERVICES

312A5157P1

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962013033541

NSN

5962-01-303-3541

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312A5157P1

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962013033541

NSN

5962-01-303-3541

MFG

BAE SYSTEMS CONTROLS INC.

Description

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY LENGTH: 0.405 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-4 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 2 DRIVER, POWER
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS AND ELECTROSTATIC SENSITIVE
III OVERALL HEIGHT: 0.325 INCHES MINIMUM AND 0.400 INCHES MAXIMUM
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: DUAL 1 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
STORAGE TEMP RANGE: -55.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 8 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 20.0 VOLTS MAXIMUM POWER SOURCE

TSC428MJA

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962013033541

NSN

5962-01-303-3541

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TSC428MJA

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962013033541

NSN

5962-01-303-3541

MFG

TELEDYNE INC

Description

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY LENGTH: 0.405 INCHES MAXIMUM
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
CASE OUTLINE SOURCE AND DESIGNATOR: D-4 MIL-M-38510
DESIGN FUNCTION AND QUANTITY: 2 DRIVER, POWER
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS AND ELECTROSTATIC SENSITIVE
III OVERALL HEIGHT: 0.325 INCHES MINIMUM AND 0.400 INCHES MAXIMUM
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: DUAL 1 INPUT
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
STORAGE TEMP RANGE: -55.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 8 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 20.0 VOLTS MAXIMUM POWER SOURCE

50004-1

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033546

NSN

5962-01-303-3546

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50004-1

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033546

NSN

5962-01-303-3546

MFG

RAYTHEON COMPANY DBA RAYTHEON

Description

DESIGN FUNCTION AND QUANTITY: 1 ARRAY, LOGIC
FEATURES PROVIDED: PROGRAMMABLE
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

725902-50

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033546

NSN

5962-01-303-3546

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725902-50

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033546

NSN

5962-01-303-3546

MFG

RAYTHEON COMPANY DBA RAYTHEON

Description

DESIGN FUNCTION AND QUANTITY: 1 ARRAY, LOGIC
FEATURES PROVIDED: PROGRAMMABLE
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

ROM/PROM FAMILY 048

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033546

NSN

5962-01-303-3546

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ROM/PROM FAMILY 048

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962013033546

NSN

5962-01-303-3546

MFG

DLA LAND AND MARITIME

Description

DESIGN FUNCTION AND QUANTITY: 1 ARRAY, LOGIC
FEATURES PROVIDED: PROGRAMMABLE
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

9986-CBLV

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033547

NSN

5962-01-303-3547

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9986-CBLV

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033547

NSN

5962-01-303-3547

MFG

BAE SYSTEMS INTEGRATED DEFENSE SOLUTIONS INC.

Description

BODY HEIGHT: 0.175 INCHES MAXIMUM
BODY LENGTH: 0.990 INCHES MINIMUM AND 0.995 INCHES MAXIMUM
BODY WIDTH: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

9986-CDVL

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033547

NSN

5962-01-303-3547

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9986-CDVL

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033547

NSN

5962-01-303-3547

MFG

BAE SYSTEMS INTEGRATED DEFENSE SOLUTIONS INC.

Description

BODY HEIGHT: 0.175 INCHES MAXIMUM
BODY LENGTH: 0.990 INCHES MINIMUM AND 0.995 INCHES MAXIMUM
BODY WIDTH: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

PAL10L8MJ883B

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033547

NSN

5962-01-303-3547

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PAL10L8MJ883B

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033547

NSN

5962-01-303-3547

MFG

MMI/AMD

Description

BODY HEIGHT: 0.175 INCHES MAXIMUM
BODY LENGTH: 0.990 INCHES MINIMUM AND 0.995 INCHES MAXIMUM
BODY WIDTH: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033547

NSN

5962-01-303-3547

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ROM/PROM

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033547

NSN

5962-01-303-3547

MFG

DLA LAND AND MARITIME

Description

BODY HEIGHT: 0.175 INCHES MAXIMUM
BODY LENGTH: 0.990 INCHES MINIMUM AND 0.995 INCHES MAXIMUM
BODY WIDTH: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 10 INPUT
MEMORY DEVICE TYPE: PAL
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

28734-1600-0004

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033548

NSN

5962-01-303-3548

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28734-1600-0004

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033548

NSN

5962-01-303-3548

MFG

THALES UK LIMITED, AEROSPACE DIVISION

Description

(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.170 INCHES MAXIMUM
BODY LENGTH: 2.370 INCHES MINIMUM AND 2.430 INCHES MAXIMUM
BODY WIDTH: 0.550 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC
III OVERALL HEIGHT: 0.220 INCHES MINIMUM AND 0.360 INCHES MAXIMUM
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 44 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
MEMORY DEVICE TYPE: RAM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 48 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

312A1837P3

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033548

NSN

5962-01-303-3548

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312A1837P3

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033548

NSN

5962-01-303-3548

MFG

BAE SYSTEMS CONTROLS INC.

Description

(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.170 INCHES MAXIMUM
BODY LENGTH: 2.370 INCHES MINIMUM AND 2.430 INCHES MAXIMUM
BODY WIDTH: 0.550 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC
III OVERALL HEIGHT: 0.220 INCHES MINIMUM AND 0.360 INCHES MAXIMUM
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 44 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
MEMORY DEVICE TYPE: RAM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 48 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

IDT7132LA120CB

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033548

NSN

5962-01-303-3548

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IDT7132LA120CB

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962013033548

NSN

5962-01-303-3548

MFG

INTEGRATED DEVICE TECHNOLOGY INC

Description

(NON-CORE DATA) BIT QUANTITY: 16384
(NON-CORE DATA) WORD QUANTITY: 2048
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.170 INCHES MAXIMUM
BODY LENGTH: 2.370 INCHES MINIMUM AND 2.430 INCHES MAXIMUM
BODY WIDTH: 0.550 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC
III OVERALL HEIGHT: 0.220 INCHES MINIMUM AND 0.360 INCHES MAXIMUM
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
INPUT CIRCUIT PATTERN: 44 INPUT
MAXIMUM POWER DISSIPATION RATING: 1.0 WATTS
MEMORY DEVICE TYPE: RAM
OPERATING TEMP RANGE: -55.0 TO 125.0 DEG CELSIUS
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
STORAGE TEMP RANGE: -65.0 TO 150.0 DEG CELSIUS
TERMINAL SURFACE TREATMENT: SOLDER
TERMINAL TYPE AND QUANTITY: 48 PRINTED CIRCUIT
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD
TIME RATING PER CHACTERISTIC: 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE