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5962-01-576-4931

20 Products

HMC270MS8G

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015764931

NSN

5962-01-576-4931

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HMC270MS8G

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015764931

NSN

5962-01-576-4931

MFG

HITTITE MICROWAVE CORPORATION

Description

SPECIAL FEATURES: THE HMC270MS8G AND HMC270MS8GE ARE BROADBAND NON-REFLECTIVE GAAS SPDT SWITCHES IN 8 LEAD MSOP GROUNDED BASE SURFACE MOUNT PLASTIC PACKAGES; COVERING DC TO 8 GHZ, THE SWITCH OFFERS EXCELLENT ISOLATION FROM 70 TO 35 DB; THE NEGATIVE CONTROL VOLTAGE OF
~1: NEGATIVE 5 VOLTS ALLOWS OPERATION DOWN TO DC; IF POSITIVE CONTROL IS REQUIRED ALONG WITH HIGH ISOLATION, SEE THE DC TO 3.5 GHZ HMC284MS8G NON-REFLECTIVE SPDT; FEATURES, BROADBAND PERFORMANCE, DC TO 8GHZ; VERY HIGH ISOLATION, 45 DB AT 6 GHZ; NON-REFLECTIVE
~2: DESIGN; LOW COST MSOP-8 PACKAGE, 14.8 MM2

4017290-901

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015764936

NSN

5962-01-576-4936

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4017290-901

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015764936

NSN

5962-01-576-4936

MFG

HONEYWELL INTERNATIONAL INC DBA HONEYWELL DIV AEROSPACE - ALBUQUERQUE

Description

PART NAME ASSIGNED BY CONTROLLING AGENCY: INTEGRATED CURCUIT, PULL UP NETWORK

91793094

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015764945

NSN

5962-01-576-4945

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91793094

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015764945

NSN

5962-01-576-4945

MFG

THALES

Description

PART NAME ASSIGNED BY CONTROLLING AGENCY: LOW STRESS INJECTION MOLDED PLASTIC
SPECIAL FEATURES: LEADFRAME MATERIAL, COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF
~1: GROUND; THIS ITEM IS A LOW-COST SPDT SWITCH IN 8-LEAD GROUNDED BASE MSOP PACKAGES; THE DESIGM HAS BEEN OPTIMIZED TO PROVIDE HIGH ISOLATION WITH MINIMAL INSERTION LOSS FOR MEDIUM AND LOW POWER APPLICATIONS; ON-CHIP CIRCUITRY ALLOWS POSITIVE VOLTAGE CONTROL
~2: OPERATION AT VERY LOW DC CURRENTS WITH CONTROL INPUTS COMPATIBLE WITH CMOS AND MOST TTL LOGIC FAMILIES

HMC284MS8G

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015764945

NSN

5962-01-576-4945

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HMC284MS8G

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015764945

NSN

5962-01-576-4945

MFG

HITTITE MICROWAVE CORPORATION

Description

PART NAME ASSIGNED BY CONTROLLING AGENCY: LOW STRESS INJECTION MOLDED PLASTIC
SPECIAL FEATURES: LEADFRAME MATERIAL, COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF
~1: GROUND; THIS ITEM IS A LOW-COST SPDT SWITCH IN 8-LEAD GROUNDED BASE MSOP PACKAGES; THE DESIGM HAS BEEN OPTIMIZED TO PROVIDE HIGH ISOLATION WITH MINIMAL INSERTION LOSS FOR MEDIUM AND LOW POWER APPLICATIONS; ON-CHIP CIRCUITRY ALLOWS POSITIVE VOLTAGE CONTROL
~2: OPERATION AT VERY LOW DC CURRENTS WITH CONTROL INPUTS COMPATIBLE WITH CMOS AND MOST TTL LOGIC FAMILIES

122-00681-0000

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765095

NSN

5962-01-576-5095

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122-00681-0000

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765095

NSN

5962-01-576-5095

MFG

HONEYWELL INTERNATIONAL INC DBA HONEYWELL DIV AEROSPACE-OLATHE

122-00893-0002

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765118

NSN

5962-01-576-5118

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122-00893-0002

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765118

NSN

5962-01-576-5118

MFG

HONEYWELL INTERNATIONAL INC DBA HONEYWELL DIV AEROSPACE-OLATHE

Description

PART NAME ASSIGNED BY CONTROLLING AGENCY: INTEGRATED CIRCUIT

122-00892-0002

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765123

NSN

5962-01-576-5123

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122-00892-0002

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765123

NSN

5962-01-576-5123

MFG

HONEYWELL INTERNATIONAL INC DBA HONEYWELL DIV AEROSPACE-OLATHE

Description

PART NAME ASSIGNED BY CONTROLLING AGENCY: INTEGRATED CIRCUIT

120-00466-0000

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765126

NSN

5962-01-576-5126

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120-00466-0000

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765126

NSN

5962-01-576-5126

MFG

HONEYWELL INTERNATIONAL INC DBA HONEYWELL DIV AEROSPACE-OLATHE

SN74LVTH16646DL

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765180

NSN

5962-01-576-5180

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SN74LVTH16646DL

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765180

NSN

5962-01-576-5180

MFG

TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP

91880101

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962015765226

NSN

5962-01-576-5226

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91880101

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962015765226

NSN

5962-01-576-5226

MFG

THALES

Description

III END ITEM IDENTIFICATION: MICOCIRCUIT, MEMORY
III SUPPLEMENTARY FEATURES: CONFORMS TO THE PCI-32 BIT BUS MASTER TRANSFER CAPABILITY INCLUDING PCI ENHANCED DATA COMMANDSM (133 MB/S) , AND PROVIDES THE SCATTER/ GATHER TO REDUCE INTRRUPET HANDLE AND IMPROVE PERFORMANCE; ALSO PROVIDES THE PCI POWER MANAGEMENT CAPABILITY MEET THE
PART NAME ASSIGNED BY CONTROLLING AGENCY: ATP 865
SPECIAL FEATURES: HIGH PERFORMANCE IDE CONTROLLER FOR PCI BUS, AIMING TO SUITE FILE SEVER CLASS OR RAID APPLICATION AND MEETS THE ATA-6 SPECIFICATION AND IDE PIO MODE, MULITWORD DMA AND ULTA DMA MODE, UP TO 13 MB/S RATE
~1: MOTHER BOARD ADD-IN CARD DESIGN

S29GL064N90TFI07

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962015765226

NSN

5962-01-576-5226

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S29GL064N90TFI07

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962015765226

NSN

5962-01-576-5226

MFG

SPANSION LLC

Description

III END ITEM IDENTIFICATION: MICOCIRCUIT, MEMORY
III SUPPLEMENTARY FEATURES: CONFORMS TO THE PCI-32 BIT BUS MASTER TRANSFER CAPABILITY INCLUDING PCI ENHANCED DATA COMMANDSM (133 MB/S) , AND PROVIDES THE SCATTER/ GATHER TO REDUCE INTRRUPET HANDLE AND IMPROVE PERFORMANCE; ALSO PROVIDES THE PCI POWER MANAGEMENT CAPABILITY MEET THE
PART NAME ASSIGNED BY CONTROLLING AGENCY: ATP 865
SPECIAL FEATURES: HIGH PERFORMANCE IDE CONTROLLER FOR PCI BUS, AIMING TO SUITE FILE SEVER CLASS OR RAID APPLICATION AND MEETS THE ATA-6 SPECIFICATION AND IDE PIO MODE, MULITWORD DMA AND ULTA DMA MODE, UP TO 13 MB/S RATE
~1: MOTHER BOARD ADD-IN CARD DESIGN

91862019

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962015765365

NSN

5962-01-576-5365

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91862019

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962015765365

NSN

5962-01-576-5365

MFG

THALES

Description

III END ITEM IDENTIFICATION: MICROCIRCUIT, MEMORY
III SUPPLEMENTARY FEATURES: MIRRORBIT FLASH TECHNOLOGY COMBINES YEARS OF FLASH MEMORY MANUFACTURING TO PORDUCE THE HIGHEST LEVELS OF QUALITY, RELIABILITY AND COST EFFECTIVENESS; THE DEVICE ELECTRICALLY ERASES ALL BITS WITHIN A SECTOR SIMULTANEOUSLY VIA HOT HOLE ASSISTED ERASE. THE
PART NAME ASSIGNED BY CONTROLLING AGENCY: S29GL-N MIRRORBIT FLASH FAMILY
SPECIAL FEATURES: EACH DEVIE IS ONLY REQUIRED A SINGLE 3.0 VOLT POWER SUPPLY FOR BOTH READ AND WRITE FUNCTIONS; DEVICES ARE ENTIRELY COMMAND SET COMPATIBLE WITH THE JEDEC SINGLE-POWER SUPPLY FLASH STANDARD;
~1: DATA IS PROGRAMMED USING HOT ELECTRON INJECTION

S29GL128N11TFIR2

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962015765365

NSN

5962-01-576-5365

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S29GL128N11TFIR2

MICROCIRCUIT,MEMORY

NSN, MFG P/N

5962015765365

NSN

5962-01-576-5365

MFG

SPANSION LLC

Description

III END ITEM IDENTIFICATION: MICROCIRCUIT, MEMORY
III SUPPLEMENTARY FEATURES: MIRRORBIT FLASH TECHNOLOGY COMBINES YEARS OF FLASH MEMORY MANUFACTURING TO PORDUCE THE HIGHEST LEVELS OF QUALITY, RELIABILITY AND COST EFFECTIVENESS; THE DEVICE ELECTRICALLY ERASES ALL BITS WITHIN A SECTOR SIMULTANEOUSLY VIA HOT HOLE ASSISTED ERASE. THE
PART NAME ASSIGNED BY CONTROLLING AGENCY: S29GL-N MIRRORBIT FLASH FAMILY
SPECIAL FEATURES: EACH DEVIE IS ONLY REQUIRED A SINGLE 3.0 VOLT POWER SUPPLY FOR BOTH READ AND WRITE FUNCTIONS; DEVICES ARE ENTIRELY COMMAND SET COMPATIBLE WITH THE JEDEC SINGLE-POWER SUPPLY FLASH STANDARD;
~1: DATA IS PROGRAMMED USING HOT ELECTRON INJECTION

OPA2340EA/250

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765378

NSN

5962-01-576-5378

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OPA2340EA/250

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765378

NSN

5962-01-576-5378

MFG

TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP

91810733

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765388

NSN

5962-01-576-5388

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91810733

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765388

NSN

5962-01-576-5388

MFG

THALES

Description

III END ITEM IDENTIFICATION: MICROCIRCUIT, LINEAR
PART NAME ASSIGNED BY CONTROLLING AGENCY: ADT2-1T
SPECIAL FEATURES: OPERATING TEMPERATURE RANGE IS -40 TO 85 DEGREE'S CELCIUS; FREQUENCY RNGE IS 100-250 MHZ; MAX HEIGHT OF 3.81 MM; MATERIAL: OPEN-STYLE, CREMIC BASE; TERMINATION FINISH: SOLDER PLATE OVER NICKEL

GALI-6

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765388

NSN

5962-01-576-5388

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GALI-6

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765388

NSN

5962-01-576-5388

MFG

SCIENTIFIC COMPONENTS CORP DBA MINI CIRCUITS LABORATORIES

Description

III END ITEM IDENTIFICATION: MICROCIRCUIT, LINEAR
PART NAME ASSIGNED BY CONTROLLING AGENCY: ADT2-1T
SPECIAL FEATURES: OPERATING TEMPERATURE RANGE IS -40 TO 85 DEGREE'S CELCIUS; FREQUENCY RNGE IS 100-250 MHZ; MAX HEIGHT OF 3.81 MM; MATERIAL: OPEN-STYLE, CREMIC BASE; TERMINATION FINISH: SOLDER PLATE OVER NICKEL

OPA2244EA/250

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765399

NSN

5962-01-576-5399

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OPA2244EA/250

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765399

NSN

5962-01-576-5399

MFG

TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP

OPA340NS

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765413

NSN

5962-01-576-5413

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OPA340NS

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765413

NSN

5962-01-576-5413

MFG

TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP

SN74AHCT1G32DCK

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765415

NSN

5962-01-576-5415

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SN74AHCT1G32DCK

MICROCIRCUIT,DIGITAL

NSN, MFG P/N

5962015765415

NSN

5962-01-576-5415

MFG

TEXAS INSTRUMENTS INCORPORATED DBA TEXAS INSTRUMENTS DIV SEMICONDUCTOR GROUP

91793093

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765546

NSN

5962-01-576-5546

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91793093

MICROCIRCUIT,LINEAR

NSN, MFG P/N

5962015765546

NSN

5962-01-576-5546

MFG

THALES

Description

PART NAME ASSIGNED BY CONTROLLING AGENCY: GAAS MMIC SP4T NON-REFLECTIVE SWITCH, DC-3.5 GHZ
SPECIAL FEATURES: PACKAGE BODY MATERIAL, LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED; LEADFRAME PLATING, SN PB SOLDER; MSL RATING, MSL1 (1); STORAGE TEMPERATURE, -65 TO POSITIVE 150 DEGREES C; OPERATING TEMPERATURE, -40 TO POSITIVE 85 DEGREES C;
~1: NOTES, LEADFRAME MATERIAL-COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND