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5961-01-291-6765

20 Products

BZX70-C43

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916765

NSN

5961-01-291-6765

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BZX70-C43

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916765

NSN

5961-01-291-6765

MFG

CENTRAL SEMICONDUCTOR CORP DIV CENTRAL STATE INDUSTRIES INC

112-001-01

SEMICONDUCTOR DEVICE SET

NSN, MFG P/N

5961012916161

NSN

5961-01-291-6161

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112-001-01

SEMICONDUCTOR DEVICE SET

NSN, MFG P/N

5961012916161

NSN

5961-01-291-6161

MFG

ECTRON CORPORATION

Description

COMPONENT FUNCTION RELATIONSHIP: MATCHED
COMPONENT NAME AND QUANTITY: 2 TRANSISTOR
INCLOSURE MATERIAL: PLASTIC
INTERNAL CONFIGURATION: FIELD EFFECT
OVERALL LENGTH: 0.210 INCHES MAXIMUM
TERMINAL TYPE AND QUANTITY: 3 UNINSULATED WIRE LEAD SINGLE TRANSISTOR

717720728-009

SEMICONDUCTOR DEVICE ASSEMBLY

NSN, MFG P/N

5961012916218

NSN

5961-01-291-6218

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717720728-009

SEMICONDUCTOR DEVICE ASSEMBLY

NSN, MFG P/N

5961012916218

NSN

5961-01-291-6218

MFG

LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN

Description

III END ITEM IDENTIFICATION: LANTIRN MOB SHELTER SET
MAJOR COMPONENTS: SOCKET,PLUG IN 1;SEMICONDUCTOR DEVICES 2

717720723-009

SEMICONDUCTOR DEVICE ASSEMBLY

NSN, MFG P/N

5961012916219

NSN

5961-01-291-6219

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717720723-009

SEMICONDUCTOR DEVICE ASSEMBLY

NSN, MFG P/N

5961012916219

NSN

5961-01-291-6219

MFG

LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN

Description

III END ITEM IDENTIFICATION: LANTIRN MOB SHELTER SET
MAJOR COMPONENTS: CIRCUIT BOARD 1;SEMICONDUCTORS 3;SOCKET,PLUG IN 1

1328

TRANSISTOR

NSN, MFG P/N

5961012916408

NSN

5961-01-291-6408

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1328

TRANSISTOR

NSN, MFG P/N

5961012916408

NSN

5961-01-291-6408

MFG

LOCKHEED MARTIN CORPORATION DBA LOCKHEED MARTIN

Description

FEATURES PROVIDED: HERMETICALLY SEALED CASE
INCLOSURE MATERIAL: CERAMIC OR GLASS OR METAL
INTERNAL CONFIGURATION: JUNCTION CONTACT
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 200.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: PRESS FIT
OVERALL HEIGHT: 0.075 INCHES MAXIMUM
OVERALL LENGTH: 0.220 INCHES NOMINAL
OVERALL WIDTH: 0.150 INCHES NOMINAL
SEMICONDUCTOR MATERIAL: SILICON
SPECIAL FEATURES: JUNCTION PATTERN ARRANGEMENT: PNP

TS-3955

TRANSISTOR

NSN, MFG P/N

5961012916408

NSN

5961-01-291-6408

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TS-3955

TRANSISTOR

NSN, MFG P/N

5961012916408

NSN

5961-01-291-6408

MFG

MICROSEMI CORP.- MASSACHUSETTS DBA MICROSEMI LAWRENCE

Description

FEATURES PROVIDED: HERMETICALLY SEALED CASE
INCLOSURE MATERIAL: CERAMIC OR GLASS OR METAL
INTERNAL CONFIGURATION: JUNCTION CONTACT
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 200.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: PRESS FIT
OVERALL HEIGHT: 0.075 INCHES MAXIMUM
OVERALL LENGTH: 0.220 INCHES NOMINAL
OVERALL WIDTH: 0.150 INCHES NOMINAL
SEMICONDUCTOR MATERIAL: SILICON
SPECIAL FEATURES: JUNCTION PATTERN ARRANGEMENT: PNP

734-070-9103

TRANSISTOR

NSN, MFG P/N

5961012916410

NSN

5961-01-291-6410

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734-070-9103

TRANSISTOR

NSN, MFG P/N

5961012916410

NSN

5961-01-291-6410

MFG

HONEYWELL INTERNATIONAL INC DBA HONEYWELL DIV AEROSPACE - TORRANCE

Description

(NON-CORE DATA) CHANNEL POLARITY AND CONTROL TYPE: N-CHANNEL INSULATED GATE TYPE
CURRENT RATING PER CHARACTERISTIC: 30.00 MILLIAMPERES MAXIMUM DRAIN CURRENT
FEATURES PROVIDED: BURN IN AND HERMETICALLY SEALED CASE AND ELECTROSTATIC SENSITIVE
INCLOSURE MATERIAL: METAL
INTERNAL CONFIGURATION: FIELD EFFECT
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION: TO-72
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: TERMINAL
OVERALL DIAMETER: 0.209 INCHES MINIMUM AND 0.230 INCHES MAXIMUM
OVERALL LENGTH: 0.170 INCHES MINIMUM AND 0.210 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 800.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL CIRCLE DIAMETER: 0.090 INCHES MINIMUM AND 0.110 INCHES MAXIMUM
TERMINAL LENGTH: 0.500 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY: 4 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 25.0 MAXIMUM DRAIN TO SOURCE VOLTAGE

C6802

TRANSISTOR

NSN, MFG P/N

5961012916410

NSN

5961-01-291-6410

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C6802

TRANSISTOR

NSN, MFG P/N

5961012916410

NSN

5961-01-291-6410

MFG

CRYSTALONICS INC.

Description

(NON-CORE DATA) CHANNEL POLARITY AND CONTROL TYPE: N-CHANNEL INSULATED GATE TYPE
CURRENT RATING PER CHARACTERISTIC: 30.00 MILLIAMPERES MAXIMUM DRAIN CURRENT
FEATURES PROVIDED: BURN IN AND HERMETICALLY SEALED CASE AND ELECTROSTATIC SENSITIVE
INCLOSURE MATERIAL: METAL
INTERNAL CONFIGURATION: FIELD EFFECT
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION: TO-72
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: TERMINAL
OVERALL DIAMETER: 0.209 INCHES MINIMUM AND 0.230 INCHES MAXIMUM
OVERALL LENGTH: 0.170 INCHES MINIMUM AND 0.210 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 800.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL CIRCLE DIAMETER: 0.090 INCHES MINIMUM AND 0.110 INCHES MAXIMUM
TERMINAL LENGTH: 0.500 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY: 4 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 25.0 MAXIMUM DRAIN TO SOURCE VOLTAGE

SFE1121H

TRANSISTOR

NSN, MFG P/N

5961012916410

NSN

5961-01-291-6410

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SFE1121H

TRANSISTOR

NSN, MFG P/N

5961012916410

NSN

5961-01-291-6410

MFG

FREESCALE SEMICONDUCTOR INC.

Description

(NON-CORE DATA) CHANNEL POLARITY AND CONTROL TYPE: N-CHANNEL INSULATED GATE TYPE
CURRENT RATING PER CHARACTERISTIC: 30.00 MILLIAMPERES MAXIMUM DRAIN CURRENT
FEATURES PROVIDED: BURN IN AND HERMETICALLY SEALED CASE AND ELECTROSTATIC SENSITIVE
INCLOSURE MATERIAL: METAL
INTERNAL CONFIGURATION: FIELD EFFECT
JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION: TO-72
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 175.0 DEG CELSIUS JUNCTION
MOUNTING METHOD: TERMINAL
OVERALL DIAMETER: 0.209 INCHES MINIMUM AND 0.230 INCHES MAXIMUM
OVERALL LENGTH: 0.170 INCHES MINIMUM AND 0.210 INCHES MAXIMUM
POWER RATING PER CHARACTERISTIC: 800.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL CIRCLE DIAMETER: 0.090 INCHES MINIMUM AND 0.110 INCHES MAXIMUM
TERMINAL LENGTH: 0.500 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY: 4 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 25.0 MAXIMUM DRAIN TO SOURCE VOLTAGE

653-104-9102

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916411

NSN

5961-01-291-6411

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653-104-9102

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916411

NSN

5961-01-291-6411

MFG

HONEYWELL INTERNATIONAL INC DBA HONEYWELL DIV AEROSPACE - TORRANCE

Description

CURRENT RATING PER CHARACTERISTIC: 3.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE AND 500.00 MICROAMPERES MAXIMUM REVERSE CURRENT, INSTANTANEOUS
FEATURES PROVIDED: HERMETICALLY SEALED CASE
INCLOSURE MATERIAL: GLASS
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 150.0 DEG CELSIUS AMBIENT AIR
MOUNTING METHOD: TERMINAL
OVERALL DIAMETER: 0.145 INCHES MAXIMUM
OVERALL LENGTH: 0.300 INCHES NOMINAL
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL LENGTH: 0.975 INCHES NOMINAL
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 300.0 MAXIMUM REVERSE VOLTAGE, PEAK

UTG4042

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916411

NSN

5961-01-291-6411

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UTG4042

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916411

NSN

5961-01-291-6411

MFG

MICRO USPD INC

Description

CURRENT RATING PER CHARACTERISTIC: 3.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE AND 500.00 MICROAMPERES MAXIMUM REVERSE CURRENT, INSTANTANEOUS
FEATURES PROVIDED: HERMETICALLY SEALED CASE
INCLOSURE MATERIAL: GLASS
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 150.0 DEG CELSIUS AMBIENT AIR
MOUNTING METHOD: TERMINAL
OVERALL DIAMETER: 0.145 INCHES MAXIMUM
OVERALL LENGTH: 0.300 INCHES NOMINAL
SEMICONDUCTOR MATERIAL: SILICON
TERMINAL LENGTH: 0.975 INCHES NOMINAL
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 300.0 MAXIMUM REVERSE VOLTAGE, PEAK

A400113-1

TRANSISTOR

NSN, MFG P/N

5961012916758

NSN

5961-01-291-6758

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A400113-1

TRANSISTOR

NSN, MFG P/N

5961012916758

NSN

5961-01-291-6758

MFG

MICROPHASE SYSTEMS INC SUB OF MICROPHASE CORP

NE02135C

TRANSISTOR

NSN, MFG P/N

5961012916758

NSN

5961-01-291-6758

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NE02135C

TRANSISTOR

NSN, MFG P/N

5961012916758

NSN

5961-01-291-6758

MFG

NIPPON COMMUNICATION EQUIPMENT COMPA N

25C1426

TRANSISTOR

NSN, MFG P/N

5961012916759

NSN

5961-01-291-6759

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25C1426

TRANSISTOR

NSN, MFG P/N

5961012916759

NSN

5961-01-291-6759

MFG

NIPPON COMMUNICATION EQUIPMENT COMPA N

A400114-1

TRANSISTOR

NSN, MFG P/N

5961012916759

NSN

5961-01-291-6759

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A400114-1

TRANSISTOR

NSN, MFG P/N

5961012916759

NSN

5961-01-291-6759

MFG

MICROPHASE SYSTEMS INC SUB OF MICROPHASE CORP

6-6412-95

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916761

NSN

5961-01-291-6761

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6-6412-95

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916761

NSN

5961-01-291-6761

MFG

SKYWORKS SOLUTIONS INC.

DLA6427-92

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916762

NSN

5961-01-291-6762

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DLA6427-92

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916762

NSN

5961-01-291-6762

MFG

SKYWORKS SOLUTIONS INC.

DLA6273-07-197-001

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916763

NSN

5961-01-291-6763

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DLA6273-07-197-001

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916763

NSN

5961-01-291-6763

MFG

SKYWORKS SOLUTIONS INC.

BZX70-C62

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916764

NSN

5961-01-291-6764

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BZX70-C62

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916764

NSN

5961-01-291-6764

MFG

CENTRAL SEMICONDUCTOR CORP DIV CENTRAL STATE INDUSTRIES INC

BZX70C62

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916764

NSN

5961-01-291-6764

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BZX70C62

SEMICONDUCTOR DEVICE,DIODE

NSN, MFG P/N

5961012916764

NSN

5961-01-291-6764

MFG

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